Infineon unveils the world’s thinnest silicon power wafer
Infineon has unveiled the thinnest silicon power wafers ever manufactured, with a thickness of only 20 micrometres and a diameter of 300 millimetres, in a high-scale semiconductor fab.
“Infineon’s breakthrough in ultra-thin wafer technology marks a significant step forward in energy-efficient power solutions and helps us leverage the full potential of the global trends decarbonization and digitalization,” said Jochen Hanebeck, CEO at Infineon Technologies.
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